
As the functions of digital cameras, smart phones, and other mobile devices become more and more sophisticated, users are increasingly using them, and more and more lithium batteries and charging currents are increasingly required. However, conventional high-current charge control solutions use power transistors (MOSFETs) and discrete components, and use a relatively large heat sink to support high-current charging. This is in contradiction with the requirement for high current and small size of mobile devices. In order to solve this contradiction, the new R2A20057BM greatly reduces the area of ​​the chip itself and the overall area of ​​the charging control solution by integrating the power MOSFET and the charging circuit on a single chip and using a wafer-level package. Wafer-level packaging technology supports higher currents by reducing the impedance of the package. In addition, the R2A20057BM integrates an efficient step-down DC-DC converter (BUCK convertor) to achieve high current charging while minimizing heat generation.
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