LED heat dissipation hope that the average temperature plate

Acmecools Tech. Ltd., a leading manufacturer of thermal components, has successfully demonstrated that it can be applied to the cloud (high-end server and graphic card) and communication. High-power LED lighting, electric vehicles, and solar thermal applications can solve the problem that is currently under the influence of poor product reliability and performance, can effectively improve its stability, and then lead into the market.

Take the LED industry as an example:

As everyone knows, the LED itself will generate temperature when it is in operation. With the current packaging features, heat is not easily dissipated. In order to reduce the heat failure and extend the life of LEDs, the industry can only rely on large-area heat sinks. LED large-area heat sinks have long been a bottleneck for LED lighting, but they also indirectly lead to glare and performance and pose an eye hazard. Therefore, to solve these doubts, the design of the thermal module is absolutely critical. Under a good heat dissipation design, the product can take into consideration stable light emitting efficiency and quality, thereby reducing heat failure and improving the life of the product and its surrounding components. There are several different interpretations of the thermal module, but how can it effectively and truly export the high heat of the die, and provide industry standards and specifications, and then lead to the design, manufacturing, security management, etc., is the LED industry is currently anxious Looking for.

Because the isothermal (heat) plate has an excellent uniformity of temperature and conduction characteristics, the “hot spot” of the high heat flux can be instantaneously expanded to a large heat dissipation area, and the heat is extracted by the heat radiating fins. The principle is nothing more than the change in the gas phase of the capillary structure containing the inner wall, the vacuum chamber and the liquid substance.

In view of the fact that the so-called isothermal (heat) plate in the market is generally referred to as a cold plate material (Cold Plate, not Vapor Chamber), such as: a copper plate, an aluminum plate, a ceramic plate, Graphite, etc. , not the true heat transfer vacuum element Vapor Chamber (the true XYZ conductance heat transfer element) that this product refers to. In short, the differences in the cooling capabilities of various products are considerable. The introduction of this product will truly provide solutions and significantly reduce the depletion of the limited resources of the earth.

At present, although the heat dissipation and module industry claims to have a patent for a uniform temperature (heat) plate, it is mostly a manufacturing and manufacturing patent. Not only does it fail to pass the inspection by an authoritative certification unit at the present stage, it also fails to achieve rapid quantification.

Vapor Chamber, a high performance equalizer (thermal) plate jointly developed by Extreme Technology and the R&D team in the United States, is characterized by its ability to easily assist electronic products in achieving light, thin, short, and small requirements, and is the world's first solderless In addition to the characteristics of no specific hot zone and directionality, the production technology for the isothermal (hot) plate of the injection pipe is more customizable and easier to assemble. Not only has the original patent protection independently developed, but also through the testing of domestic and foreign authoritative certification units, both in terms of price, function and product reliability far exceed the secondary market of the same type of products.