V-SN808 is a special tinning additive for vertical continuous tin plating (VCP) stannous sulfate type plating solution. It has no foam, high oxidation resistance and easy to use. In the actual performance of many customers, it surpassed the products far superior to the peers, and maintained a leading position in VCP graphic plating technology.
Five advantages of V-Sn808:
1. Special for VCP - has superior anti-foaming ability. No foam, clear bath, strong anti-Sn2+ oxidation ability, super strong backing force for the formation of tetravalent tin, long service life of bath.
2. Cost savings - smaller current, shorter time, can significantly reduce tin plating thickness to reduce solder ball waste.
3. Safer - the additive contains no solvent and will not erode the plating resist (protective layers such as dry film and line ink).
4. Easy to operate - a single additive system, the plating solution is easy to operate and control. The wide operating range and greatly improved process capability.
5. High quality - the plating layer is more delicate, the corrosion resistance is better, and the problem that the independent hole ring is not resisted can be solved.
Method of use bathing and working conditions
| standard | range | |
| Stannous sulfate | 30g/L | 20-40g/L |
| sulfuric acid | 190g/L | 180-220g/L |
| V-Sn808 | 30ml/L | 20ml-40ml |
| Cathode current density | 10ASF | 9ASF-40ASF |
| Liquid temperature | 20 ° C | 15°C--30°C |
| Tin plating thickness | 3um below 0.5 ounces | ≧3um |
| 1.0 ounce or more 5um | ≧5um |
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